Chips, Extruded Snacks, Nuts, Wafers...
Materials: BOPP/VMCPP; BOPP//PE/VMPET/CPP; BOPP//PE/VMPET/PE or customized
There are the packages which are suitable for gas-filed packing, especially good air tightness performance after gas filling. By offering high barrier materials and structure, the packages can remain the contents freshness and good taste.
Address: No. 1 Yinggui Street, West District, Zhongshan City, Guangdong Province, China
Tel: 0760 - 8855 8919 / 8855 1819
Email: lkpack@163.com
Website: http://www.langkepackaging.com